Gold CPU silicon thermal compound

silicon thermal compound *Color:Gold *Paste weight:5g /1.1oz *Thermal conductivity:3.2W/m-k *Thermal resistance:<0.159-in2/W

silicon thermal compound

theromal paste

Thermal Grease Paste

CPU silicon thermal Grease/grey thermal paste/heatsink compounds Introductions

This thermal grease paste is suitable for CPU heatsink or chip, and it is syringe design for easy operation.

Features:Syringe design for easy operation. Helps disperse the heat from CPU to heatsink effectively.Suitable for CPU heatsink or chip.High temperature resistance.Non-toxic, tasteless, non-corrosive.Primary use: Thermal coupling of electrical / electronic devices to heat sinks.Special properties: High conductivity; low bleed; stable at high temperatures.

 

Item	Unit	Environmental	Test method	WT160	WT180	GY260	GY280	GD660	GN680
Color	No	25 °C	Visual	WHITE	WHITE	GREY	GREY	GOLD	GREEN
Thermal Conductivity	W/m-K	No	ROCT8.140-82	>0.6	>1.2	>1.0	>1.4	>2.4	>2.0
Thermal Impedance	°C-in2/W	25°C	ASTM D1470	<0.258	<0.200	<0.211	<0.180	<0.159	<0.167
Specific Gravity	No	25°C	ASTM D1475	>2.0	>2.4	>2.	>2.4	>2.5	>2.4
Evaporation	%	150°C/24Hours	Fed.Std.791	<0.001	<0.001	<0.001	<0.001	<0.001	<0.001
Bleed	%	150°C/24Hours	Fed.Std.791	<0.05	<0.05	<0.05	<0.05	<0.05	<0.05
Dielectric Constant A	No	100Hz	ASTM D150	>5.0	>5.0	>5.0	>5.0	>5	>5.0
Viscosity	No	25°C	____	No flow	No flow	No flow	No flow	No flow	No flow
Penetration Degree	1/10 mm	25°C	GB/T-269	380±10	380±10	380±10	380±10	380±10	380±10

 

  

Specification:Color: GoldPaste weight: 5g / 1.1ozThermal conductivity:3.2W/m-kThermal resistance: <0.159 °C-in2/W

 

Package list:1 * 5g GoldThermal Grease Paste

30pcs/bag

3000pcs/ctn

 

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

Our service:

1.OEM silicon thermal compound pack,we could do free design as customer requirement.

2.With our own brand carton or as customer requirement if qty up to 10k.

3.Protection of your sales area,ideas of design and all your private information.

 ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

Payment term:

1.Payment:T/T only,30%deposit,the balance before delivery.

2.Production leading time:10-15days,see qty to confirm.

3.Shipping out:Guangzhou or Shenzhen.

 

 

  

Gold CPU silicon thermal compound